Patent Assignment Details
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| Reel/Frame: | 053468/0643 | |
| Pages: | 5 |
| | Recorded: | 08/12/2020 | | |
| Attorney Dkt #: | TSM15-0921 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE 4TH & 5TH INVENTOR'S NAME FROM "HSIEN-WEI CHEN CHEN" TO HSIEN-WEI CHEN & "MING-DA CHENG CHENG" TO "MING-DA CHENG" PREVIOUSLY RECORDED AT REEL: 036530 FRAME: 0739. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/14/2017
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Application #:
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14815584
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Filing Dt:
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07/31/2015
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Publication #:
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Pub Dt:
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02/02/2017
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Title:
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Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof
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Assignee
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| 8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP
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17950 PRESTON ROAD, SUITE 1000
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DALLAS, TX 75252
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