Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 053500/0253 | |
| Pages: | 8 |
| | Recorded: | 08/14/2020 | | |
| Attorney Dkt #: | 05847.069US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/12/2022
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Application #:
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16993860
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Filing Dt:
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08/14/2020
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Publication #:
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Pub Dt:
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11/26/2020
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Title:
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Die Features for Self-Alignment During Die Bonding
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Assignee
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83716 |
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Correspondence name and address
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PARSONS BEHLE & LATIMER - MICRON MICRON
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800 W. MAIN STREET
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SUITE 1300
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BOISE, ID 83702
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05/15/2024 07:52 AM
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