Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 053609/0613 | |
| Pages: | 8 |
| | Recorded: | 08/26/2020 | | |
| Attorney Dkt #: | 089994-0023 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/20/2021
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Application #:
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16976069
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Filing Dt:
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08/26/2020
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Publication #:
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Pub Dt:
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02/11/2021
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Title:
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CU ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignees
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| 13-1, NIHONBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN 1030027 |
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| 158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 358-0032 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITAL STREET, N.W.
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WASHINGTON, DC 20001
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04/29/2024 03:56 PM
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