Patent Assignment Details
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| Reel/Frame: | 053682/0053 | |
| Pages: | 5 |
| | Recorded: | 09/03/2020 | | |
| Attorney Dkt #: | 532545US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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17010926
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Filing Dt:
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09/03/2020
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Publication #:
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Pub Dt:
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09/09/2021
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Title:
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SEMICONDUCTOR DEVICE HAVING A RESIN LAYER SEALING A PLURALITY OF SECONDUCTOR CHIPS STACKED ON FIRST SEMICONDUCTOR CHIPS
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Assignee
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| 1-21, SHIBAURA 3-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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OBLON, ET AL.
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1940 DUKE STREET
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ALEXANDRIA, VA 22314
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