Patent Assignment Details
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Reel/Frame: | 053699/0882 | |
| Pages: | 4 |
| | Recorded: | 09/04/2020 | | |
Attorney Dkt #: | 026057.P44842US1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/09/2023
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Application #:
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17013279
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Filing Dt:
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09/04/2020
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Publication #:
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Pub Dt:
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09/30/2021
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Title:
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Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring
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Assignee
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ONE APPLE PARK WAY |
CUPERTINO, CALIFORNIA 95014 |
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Correspondence name and address
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JAFFERY WATSON MENDONSA & HAMILTON LLP
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7501 VILLAGE SQUARE DRIVE, SUITE 206
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CASTLE PINES, CO 80108
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04/29/2024 08:15 AM
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