Patent Assignment Details
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Reel/Frame: | 053761/0449 | |
| Pages: | 2 |
| | Recorded: | 09/14/2020 | | |
Attorney Dkt #: | TSMP20200496US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/06/2022
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Application #:
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17019913
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Filing Dt:
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09/14/2020
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Publication #:
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Pub Dt:
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09/30/2021
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Title:
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Wafer Bonding Method
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Assignee
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP/TSMC
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17950 PRESTON ROAD, SUITE 1000
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DALLAS, TX 75252
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