Patent Assignment Details
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| Reel/Frame: | 053894/0321 | |
| Pages: | 3 |
| | Recorded: | 09/26/2020 | | |
| Attorney Dkt #: | 20088 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17033704
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Filing Dt:
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09/26/2020
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Publication #:
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Pub Dt:
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01/21/2021
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Title:
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THERMALLY CONDUCTIVE COMPOSITE PARTICLES, METHOD FOR PRODUCING SAME, INSULATING RESIN COMPOSITION, INSULATING RESIN MOLDED BODY, LAMINATE FOR CIRCUIT BOARDS, METAL BASE CIRCUIT BOARD AND POWER MODULE
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Assignee
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| 3-10, FUKUURA, KANAZAWA-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 236-0004 |
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Correspondence name and address
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HOLTZ, HOLTZ & VOLEK PC
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630 NINTH AVENUE
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SUITE 1010
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NEW YORK, NY 10036-3744
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