Total properties:
42
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Patent #:
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Issue Dt:
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11/13/2007
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Application #:
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10502336
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Filing Dt:
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09/23/2004
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Publication #:
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Pub Dt:
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10/13/2005
| | | | |
Title:
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METHOD FOR EMBEDDING A COMPONENT IN A BASE
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Patent #:
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Issue Dt:
|
01/31/2006
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Application #:
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10502340
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Filing Dt:
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09/23/2004
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Publication #:
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Pub Dt:
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06/09/2005
| | | | |
Title:
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METHOD FOR EMBEDDING A COMPONENT IN A BASE AND FORMING A CONTACT
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Patent #:
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Issue Dt:
|
11/27/2007
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Application #:
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10546820
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Filing Dt:
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08/25/2005
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Publication #:
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Pub Dt:
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10/05/2006
| | | | |
Title:
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METHOD FOR MANUFACTURING AN ELECTRONIC MODULE
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Patent #:
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Issue Dt:
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04/13/2010
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Application #:
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10572340
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Filing Dt:
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11/14/2006
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Publication #:
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Pub Dt:
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07/19/2007
| | | | |
Title:
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METHOD FOR MANUFACTURING AN ELECTRONIC MODULE IN AN INSTALLATION BASE
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Patent #:
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Issue Dt:
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08/14/2012
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Application #:
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11570673
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Filing Dt:
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06/30/2008
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Publication #:
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Pub Dt:
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10/23/2008
| | | | |
Title:
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METHOD FOR MANUFACTURING AN ELECTRONICS MODULE COMPRISING A COMPONENT ELECTRICALLY CONNECTED TO A CONDUCTOR-PATTERN LAYER
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Patent #:
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Issue Dt:
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12/13/2011
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Application #:
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11587694
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Filing Dt:
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02/09/2007
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Publication #:
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Pub Dt:
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10/04/2007
| | | | |
Title:
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HEAT CONDUCTION FROM AN EMBEDDED COMPONENT
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Patent #:
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Issue Dt:
|
03/09/2010
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Application #:
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11659190
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Filing Dt:
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02/02/2007
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Publication #:
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Pub Dt:
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12/04/2008
| | | | |
Title:
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MANUFACTURE OF A LAYER INCLUDING A COMPONENT
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Patent #:
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Issue Dt:
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11/22/2011
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Application #:
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11667429
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Filing Dt:
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05/09/2007
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Publication #:
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Pub Dt:
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11/22/2007
| | | | |
Title:
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METHOD FOR MANUFACTURING AN ELECTRONICS MODULE
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Patent #:
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Issue Dt:
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10/01/2013
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Application #:
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11791547
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Filing Dt:
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09/28/2007
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Publication #:
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Pub Dt:
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04/24/2008
| | | | |
Title:
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ELECTRONICS MODULE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
|
06/08/2010
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Application #:
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11797609
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Filing Dt:
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05/04/2007
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Publication #:
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Pub Dt:
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09/06/2007
| | | | |
Title:
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METHOD FOR EMBEDDING A COMPONENT IN A BASE
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Patent #:
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Issue Dt:
|
08/02/2011
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Application #:
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11878557
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Filing Dt:
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07/25/2007
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Publication #:
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Pub Dt:
|
02/14/2008
| | | | |
Title:
|
METHOD FOR EMBEDDING A COMPONENT IN A BASE
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|
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Patent #:
|
|
Issue Dt:
|
10/27/2009
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Application #:
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11907795
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Filing Dt:
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10/17/2007
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Publication #:
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|
Pub Dt:
|
02/21/2008
| | | | |
Title:
|
ELECTRONIC MODULE
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|
|
Patent #:
|
|
Issue Dt:
|
08/14/2012
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Application #:
|
11917711
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Filing Dt:
|
04/28/2008
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Publication #:
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|
Pub Dt:
|
08/21/2008
| | | | |
Title:
|
METHOD FOR MANUFACTURING A CIRCUIT BOARD
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|
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Patent #:
|
|
Issue Dt:
|
07/24/2012
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Application #:
|
11917724
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Filing Dt:
|
04/28/2008
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Publication #:
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|
Pub Dt:
|
01/15/2009
| | | | |
Title:
|
METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE, AND A CIRCUIT BOARD STRUCTURE
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|
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Patent #:
|
|
Issue Dt:
|
11/12/2013
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Application #:
|
11917737
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Filing Dt:
|
04/28/2008
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Publication #:
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|
Pub Dt:
|
08/28/2008
| | | | |
Title:
|
METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE
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|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
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Application #:
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12293412
|
Filing Dt:
|
09/17/2008
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Publication #:
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|
Pub Dt:
|
05/28/2009
| | | | |
Title:
|
MANUFACTURE OF A CIRCUIT BOARD CONTAINING A COMPONENT
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|
|
Patent #:
|
|
Issue Dt:
|
10/16/2012
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Application #:
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12420617
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Filing Dt:
|
04/08/2009
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Publication #:
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|
Pub Dt:
|
10/22/2009
| | | | |
Title:
|
METHOD OF MANUFACTURING A WIRING BOARD
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|
|
Patent #:
|
|
Issue Dt:
|
02/25/2014
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Application #:
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12506519
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Filing Dt:
|
07/21/2009
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Publication #:
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|
Pub Dt:
|
03/04/2010
| | | | |
Title:
|
MULTI-CHIP PACKAGE AND MANUFACTURING METHOD
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|
|
Patent #:
|
|
Issue Dt:
|
01/21/2014
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Application #:
|
12546454
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Filing Dt:
|
08/24/2009
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Publication #:
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|
Pub Dt:
|
02/25/2010
| | | | |
Title:
|
CIRCUIT BOARD STRUCTURE COMPRISING AN ELECTRICAL COMPONENT AND A METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE COMPRISING AN ELECTRICAL COMPONENT
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|
|
Patent #:
|
|
Issue Dt:
|
08/26/2014
|
Application #:
|
12603324
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Filing Dt:
|
10/21/2009
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Publication #:
|
|
Pub Dt:
|
04/29/2010
| | | | |
Title:
|
SINGLE-LAYER COMPONENT PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
10/11/2011
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Application #:
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12619350
|
Filing Dt:
|
11/16/2009
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Publication #:
|
|
Pub Dt:
|
03/11/2010
| | | | |
Title:
|
ELECTRONIC MODULE WITH A CONDUCTIVE-PATTERN LAYER AND A METHOD OF MANUFACTURING SAME
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|
|
Patent #:
|
|
Issue Dt:
|
07/17/2012
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Application #:
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12699628
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Filing Dt:
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02/03/2010
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Publication #:
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|
Pub Dt:
|
08/12/2010
| | | | |
Title:
|
ELECTRIC MODULE HAVING A CONDUCTIVE PATTERN LAYER
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|
|
Patent #:
|
|
Issue Dt:
|
07/16/2013
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Application #:
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12702653
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Filing Dt:
|
02/09/2010
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Publication #:
|
|
Pub Dt:
|
08/12/2010
| | | | |
Title:
|
CIRCUIT BOARD INCLUDING AN EMBEDDED COMPONENT
|
|
|
Patent #:
|
|
Issue Dt:
|
01/05/2016
|
Application #:
|
12753329
|
Filing Dt:
|
04/02/2010
|
Publication #:
|
|
Pub Dt:
|
07/29/2010
| | | | |
Title:
|
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2013
|
Application #:
|
12773628
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Filing Dt:
|
05/04/2010
|
Publication #:
|
|
Pub Dt:
|
08/26/2010
| | | | |
Title:
|
ELECTRONICS MODULE COMPRISING AN EMBEDDED MICROCIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
08/07/2012
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Application #:
|
12842052
|
Filing Dt:
|
07/23/2010
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Publication #:
|
|
Pub Dt:
|
01/26/2012
| | | | |
Title:
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ELECTRONIC MODULE WITH VERTICAL CONNECTOR BETWEEN CONDUCTOR PATTERNS
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|
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Patent #:
|
|
Issue Dt:
|
05/27/2014
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Application #:
|
12842055
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Filing Dt:
|
07/23/2010
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Publication #:
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|
Pub Dt:
|
01/26/2012
| | | | |
Title:
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ELECTRONIC MODULE WITH EMBEDDED JUMPER CONDUCTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2013
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Application #:
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12842056
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Filing Dt:
|
07/23/2010
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Publication #:
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Pub Dt:
|
12/09/2010
| | | | |
Title:
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ELECTRONIC MODULE WITH FEED THROUGH CONDUCTOR BETWEEN WIRING PATTERNS
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|
|
Patent #:
|
|
Issue Dt:
|
08/16/2016
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Application #:
|
12872538
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Filing Dt:
|
08/31/2010
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Publication #:
|
|
Pub Dt:
|
03/01/2012
| | | | |
Title:
|
METHOD FOR CONTROLLING WARPAGE WITHIN ELECTRONIC PRODUCTS AND AN ELECTRONIC PRODUCT
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|
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Patent #:
|
|
Issue Dt:
|
04/15/2014
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Application #:
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12990785
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Filing Dt:
|
11/03/2010
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Publication #:
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|
Pub Dt:
|
03/17/2011
| | | | |
Title:
|
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2014
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Application #:
|
13118650
|
Filing Dt:
|
05/31/2011
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Publication #:
|
|
Pub Dt:
|
12/01/2011
| | | | |
Title:
|
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND AN ELECTRONIC MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/05/2013
|
Application #:
|
13185165
|
Filing Dt:
|
07/18/2011
|
Publication #:
|
|
Pub Dt:
|
11/03/2011
| | | | |
Title:
|
METHOD FOR EMBEDDING A COMPONENT IN A BASE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/29/2016
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Application #:
|
13698670
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Filing Dt:
|
03/25/2013
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Publication #:
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|
Pub Dt:
|
07/11/2013
| | | | |
Title:
|
MANUFACTURING METHOD AND ELECTRONIC MODULE WITH NEW ROUTING POSSIBILITIES
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|
|
Patent #:
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|
Issue Dt:
|
04/11/2017
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Application #:
|
14076292
|
Filing Dt:
|
11/11/2013
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Publication #:
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|
Pub Dt:
|
03/06/2014
| | | | |
Title:
|
Method for Manufacturing a Circuit Board Structure
|
|
|
Patent #:
|
|
Issue Dt:
|
08/11/2015
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Application #:
|
14231758
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Filing Dt:
|
04/01/2014
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Publication #:
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|
Pub Dt:
|
07/31/2014
| | | | |
Title:
|
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
09/25/2018
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Application #:
|
14467079
|
Filing Dt:
|
08/25/2014
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Publication #:
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Pub Dt:
|
02/12/2015
| | | | |
Title:
|
ELECTRONIC MODULE
|
|
|
Patent #:
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|
Issue Dt:
|
06/12/2018
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Application #:
|
14569900
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Filing Dt:
|
12/15/2014
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Publication #:
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Pub Dt:
|
06/16/2016
| | | | |
Title:
|
METHOD FOR FABRICATION OF AN ELECTRONIC MODULE AND ELECTRONIC MODULE
|
|
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Patent #:
|
|
Issue Dt:
|
06/26/2018
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Application #:
|
14622954
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Filing Dt:
|
02/16/2015
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Publication #:
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|
Pub Dt:
|
06/11/2015
| | | | |
Title:
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Electronic module with EMI protection
|
|
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Patent #:
|
|
Issue Dt:
|
06/07/2016
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Application #:
|
14623569
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Filing Dt:
|
02/17/2015
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Publication #:
|
|
Pub Dt:
|
06/11/2015
| | | | |
Title:
|
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND AN ELECTRONIC MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/25/2018
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Application #:
|
14660991
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Filing Dt:
|
03/18/2015
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Publication #:
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|
Pub Dt:
|
10/08/2015
| | | | |
Title:
|
Manufacture of a circuit board and circuit board containing a component
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|
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Patent #:
|
|
Issue Dt:
|
04/26/2016
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Application #:
|
14821818
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Filing Dt:
|
08/10/2015
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Publication #:
|
|
Pub Dt:
|
12/03/2015
| | | | |
Title:
|
Circuit module and method of manufacturing the same
|
|
|
Patent #:
|
|
Issue Dt:
|
01/30/2018
|
Application #:
|
15084530
|
Filing Dt:
|
03/30/2016
|
Publication #:
|
|
Pub Dt:
|
07/21/2016
| | | | |
Title:
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Circuit module and method of manufacturing the same
|
|