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Reel/Frame:	054174/0502			Pages:	24
		Recorded:	10/21/2020
Attorney Dkt #:	050083-0010-2
Conveyance:	CHANGE OF ADDRESS FOR NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.

Total properties: 22

Patent #:	9331049	Issue Dt:	05/03/2016	Application #:	12866797	Filing Dt:	10/21/2010
Publication #:	US20110104510	Pub Dt:	05/05/2011
Title:	BONDING STRUCTURE OF BONDING WIRE

Patent #:	9427830	Issue Dt:	08/30/2016	Application #:	13380123	Filing Dt:	12/22/2011
Publication #:	US20120094121	Pub Dt:	04/19/2012
Title:	COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR

Patent #:	8742258	Issue Dt:	06/03/2014	Application #:	13384819	Filing Dt:	01/19/2012
Publication #:	US20130306352	Pub Dt:	11/21/2013
Title:	BONDING WIRE FOR SEMICONDUCTOR

Patent #:	10193069	Issue Dt:	01/29/2019	Application #:	14118866	Filing Dt:	11/19/2013
Publication #:	US20140084279	Pub Dt:	03/27/2014
Title:	POLYMER FOR USE IN ORGANIC ELECTROLUMINESCENT ELEMENT AND ORGANIC ELECTROLUMINESCENT ELEMENT EMPLOYING SAME

Patent #:	10411198	Issue Dt:	09/10/2019	Application #:	15102127	Filing Dt:	06/06/2016
Publication #:	US20160308130	Pub Dt:	10/20/2016
Title:	MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENTS, AND ORGANIC ELECTROLUMINESCENT ELEMENT USING SAME

Patent #:	10283721	Issue Dt:	05/07/2019	Application #:	15104661	Filing Dt:	06/15/2016
Publication #:	US20160315262	Pub Dt:	10/27/2016
Title:	MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENTS, AND ORGANIC ELECTROLUMINESCENT ELEMENT USING SAME

Patent #:	10032741	Issue Dt:	07/24/2018	Application #:	15107417	Filing Dt:	06/22/2016
Publication #:	US20170323864	Pub Dt:	11/09/2017
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	10137534	Issue Dt:	11/27/2018	Application #:	15107421	Filing Dt:	06/22/2016
Publication #:	US20170200689	Pub Dt:	07/13/2017
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	10236272	Issue Dt:	03/19/2019	Application #:	15107423	Filing Dt:	06/22/2016
Publication #:	US20170117244	Pub Dt:	04/27/2017
Title:	Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Patent #:	10468370	Issue Dt:	11/05/2019	Application #:	15107427	Filing Dt:	06/22/2016
Publication #:	US20170200690	Pub Dt:	07/13/2017
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	9773748	Issue Dt:	09/26/2017	Application #:	15116145	Filing Dt:	08/02/2016
Publication #:	US20170179064	Pub Dt:	06/22/2017
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	10305048	Issue Dt:	05/28/2019	Application #:	15116540	Filing Dt:	08/04/2016
Publication #:	US20160380199	Pub Dt:	12/29/2016
Title:	ORGANIC-ELECTROLUMINESCENT-ELEMENT MATERIAL AND ORGANIC ELECTROLUMINESCENT ELEMENTS USING SAME

Patent #:	10950570	Issue Dt:	03/16/2021	Application #:	15305238	Filing Dt:	10/19/2016
Publication #:	US20170040281	Pub Dt:	02/09/2017
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	9887172	Issue Dt:	02/06/2018	Application #:	15305584	Filing Dt:	10/20/2016
Publication #:	US20170194280	Pub Dt:	07/06/2017
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	10266637	Issue Dt:	04/23/2019	Application #:	15315215	Filing Dt:	11/30/2016
Publication #:	US20170198085	Pub Dt:	07/13/2017
Title:	POLYURETHANE-MODIFIED EPOXY RESIN, METHOD FOR PRODUCING SAME, EPOXY RESIN COMPOSITION AND CURED PRODUCT

Patent #:	10207373	Issue Dt:	02/19/2019	Application #:	15323092	Filing Dt:	12/29/2016
Publication #:	US20170136585	Pub Dt:	05/18/2017
Title:	NICKEL PARTICLE COMPOSITION, BONDING MATERIAL, AND BONDING METHOD IN WHICH SAID MATERIAL IS USED

Patent #:	10414002	Issue Dt:	09/17/2019	Application #:	15515508	Filing Dt:	03/29/2017
Publication #:	US20170216974	Pub Dt:	08/03/2017
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	10737356	Issue Dt:	08/11/2020	Application #:	15577735	Filing Dt:	11/28/2017
Publication #:	US20180130763	Pub Dt:	05/10/2018
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	10610976	Issue Dt:	04/07/2020	Application #:	15851554	Filing Dt:	12/21/2017
Publication #:	US20180133843	Pub Dt:	05/17/2018
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	10121758	Issue Dt:	11/06/2018	Application #:	15852798	Filing Dt:	12/22/2017
Publication #:	US20180122765	Pub Dt:	05/03/2018
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	10497663	Issue Dt:	12/03/2019	Application #:	16248531	Filing Dt:	01/15/2019
Publication #:	US20190164927	Pub Dt:	05/30/2019
Title:	Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Patent #:	NONE	Issue Dt:		Application #:	16311125	Filing Dt:	12/18/2018
Publication #:	US20200312808	Pub Dt:	10/01/2020
Title:	COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

Assignor

Exec Dt:

10/02/2018

Assignee

13-1, NIHONBASHI 1-CHOME, CHUO-KU

TOKYO, JAPAN 103-0027

Correspondence name and address
	TOMOKI TANIDA
	MCDERMOTT WILL & EMERY LLP
	500 NORTH CAPITOL STREET, N.W.
	WASHINGTON, DC 20001

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