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Patent Assignment Details
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Reel/Frame:054344/0672   Pages: 7
Recorded: 11/12/2020
Attorney Dkt #:INTEL DTSCHLND FOR GOOGLE
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 4
1
Patent #:
Issue Dt:
05/06/2014
Application #:
13346993
Filing Dt:
01/10/2012
Publication #:
Pub Dt:
07/11/2013
Title:
ENHANCED FLIP CHIP PACKAGE
2
Patent #:
Issue Dt:
12/09/2014
Application #:
13802848
Filing Dt:
03/14/2013
Publication #:
Pub Dt:
09/18/2014
Title:
CHIP ARRANGEMENTS
3
Patent #:
Issue Dt:
06/16/2015
Application #:
14164289
Filing Dt:
01/27/2014
Publication #:
Pub Dt:
05/22/2014
Title:
ENHANCED FLIP CHIP PACKAGE
4
Patent #:
Issue Dt:
07/05/2016
Application #:
14370971
Filing Dt:
07/08/2014
Publication #:
Pub Dt:
01/29/2015
Title:
SEMICONDUCTOR DEVICES
Assignor
1
Exec Dt:
11/09/2020
Assignee
1
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondence name and address
ANGELA MILLER
C/O CPA GLOBAL
900 SECOND AVENUE SOUTH, SUITE 600
MINNEAPOLIS, MN 55402

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