Patent Assignment Details
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| Reel/Frame: | 054449/0653 | |
| Pages: | 3 |
| | Recorded: | 11/23/2020 | | |
| Attorney Dkt #: | 53EH-303357-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/15/2022
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Application #:
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17102104
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Filing Dt:
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11/23/2020
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Publication #:
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Pub Dt:
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03/11/2021
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Title:
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MULTILAYERED MEMORY DEVICE WITH THROUGH-SILICON VIA(TSV), SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| NO. 388, XINGYE AVENUE |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI CITY, ANHUI, CHINA |
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Correspondence name and address
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SHEPPARD MULLIN RICHTER & HAMPTON LLP
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379 LYTTON AVE.
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ATTN: JING ZHENG
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PALO ALTO, CA 94301
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