Patent Assignment Details
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Reel/Frame: | 054453/0063 | |
| Pages: | 2 |
| | Recorded: | 11/17/2020 | | |
Attorney Dkt #: | SY7IP-1008 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/28/2023
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Application #:
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16950602
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Filing Dt:
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11/17/2020
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Publication #:
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Pub Dt:
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06/24/2021
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Title:
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MECHANICAL VIBRATION BONDING APPARATUS AND MECHANICAL VIBRATION BONDING METHOD
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Assignee
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2-9-28 HIGASHIHIE, HAKATA-KU, FUKUOKA-SHI |
FUKUOKA, JAPAN 812-0007 |
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Correspondence name and address
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SHINTARO YAMADA
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30 BROAD ST.
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21ST FLOOR
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NEW YORK, NY 10004
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