Patent Assignment Details
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Reel/Frame: | 054464/0489 | |
| Pages: | 4 |
| | Recorded: | 11/24/2020 | | |
Attorney Dkt #: | 105019-0038 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/05/2022
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Application #:
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17103887
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Filing Dt:
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11/24/2020
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Publication #:
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Pub Dt:
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06/03/2021
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Title:
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SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE FOR SUPPRESSING THE PROPAGATION OF CRACKS
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Assignee
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2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI |
KANAGAWA, JAPAN 222-0033 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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05/05/2024 10:34 AM
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