Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 054504/0632 | |
| Pages: | 4 |
| | Recorded: | 12/01/2020 | | |
| Attorney Dkt #: | TSMCP1273US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/20/2022
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Application #:
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17097406
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Filing Dt:
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11/13/2020
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Publication #:
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Pub Dt:
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05/19/2022
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Title:
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TWO 2D CAPPING LAYERS ON INTERCONNECT CONDUCTIVE STRUCTURE TO INCREASE INTERCONNECT STRUCTURE RELIABILITY
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK, LLC
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ROSETTA CENTER
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629 EUCLID AVE., SUITE 1000
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CLEVELAND, OH 44114
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