Patent Assignment Details
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| Reel/Frame: | 054539/0394 | |
| Pages: | 4 |
| | Recorded: | 12/03/2020 | | |
| Attorney Dkt #: | P20193953US00/N1085-02183 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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17110122
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Filing Dt:
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12/02/2020
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Publication #:
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Pub Dt:
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08/05/2021
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Title:
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FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
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Assignee
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| NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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DUANE MORRIS LLP (TSMC) IP DEPARTMENT
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30 SOUTH 17TH STREET
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PHILADELPHIA, PA 19103-4196
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