Patent Assignment Details
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| Reel/Frame: | 054542/0873 | |
| Pages: | 6 |
| | Recorded: | 12/04/2020 | | |
| Attorney Dkt #: | 20367-150085-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/07/2023
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Application #:
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17043444
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Filing Dt:
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09/29/2020
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Publication #:
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Pub Dt:
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01/21/2021
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Title:
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METHOD FOR PRODUCING POLYIMIDE PRECURSOR, METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN CURED PRODUCT, METHOD FOR PRODUCING INTERLAYER INSULATING FILM, COVER COAT LAYER OR SURFACE PROTECTIVE FILM, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
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Assignee
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| 4-25, KORAKU 1-CHOME |
| BUNKYO-KU |
| TOKYO, JAPAN 112-0004 |
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Correspondence name and address
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ALAN E. SCHIAVELLI
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1250 23RD STREET NW, SUITE 410
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WASHINGTON, DC 20037-1164
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