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Reel/Frame:054581/0223   Pages: 3
Recorded: 12/08/2020
Attorney Dkt #:20193287/24061.4107US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/06/2022
Application #:
17111417
Filing Dt:
12/03/2020
Publication #:
Pub Dt:
08/19/2021
Title:
STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH RESISTIVE ELEMENTS
Assignors
1
Exec Dt:
11/02/2020
2
Exec Dt:
11/02/2020
3
Exec Dt:
11/02/2020
Assignee
1
NO. 8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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