Patent Assignment Details
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| Reel/Frame: | 054648/0082 | |
| Pages: | 7 |
| | Recorded: | 12/09/2020 | | |
| Attorney Dkt #: | 2017.021US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16642971
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Filing Dt:
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08/04/2020
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Publication #:
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Pub Dt:
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11/26/2020
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Title:
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High-Reliability Copper Alloy Bonding Wire for Electronic Packaging and Preparation Method Therefor
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Assignee
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| NO. 25, SOUTH HUANSHI AVENUE |
| NANSHA DISTRICT |
| GUANGZHOU CITY, GUANGDONG PROVINCE, CHINA 511458 |
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Correspondence name and address
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KRISTEN L. PURSLEY
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29 W. LAWRENCE STREET, SUITE 210
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PONTIAC, MI 48342
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05/12/2024 05:31 AM
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