Patent Assignment Details
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| Reel/Frame: | 054670/0512 | |
| Pages: | 23 |
| | Recorded: | 12/10/2020 | | |
| Attorney Dkt #: | USCP10810C/NB7074-SYO |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/02/2021
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Application #:
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16855988
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Filing Dt:
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04/22/2020
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Publication #:
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Pub Dt:
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02/25/2021
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Title:
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Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
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Assignee
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| 66-68 SHUNYU ROAD, |
| YUYAO CITY, NINGBO, ZHEJIANG PROVINCE, CHINA 315400 |
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Correspondence name and address
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RAYMOND Y CHAN
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108 N. YNEZ AVE., SUITE 128
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MONTEREY PARK, CA 91754
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