Patent Assignment Details
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| Reel/Frame: | 054684/0748 | |
| Pages: | 8 |
| | Recorded: | 12/17/2020 | | |
| Attorney Dkt #: | P61701 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/05/2024
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Application #:
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17049224
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Filing Dt:
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10/20/2020
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Publication #:
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Pub Dt:
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05/20/2021
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Title:
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RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE
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Assignee
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1008324 |
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Correspondence name and address
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GREENBLUM & BERNSTEIN, P.L.C.
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1950 ROLAND CLARKE PLACE
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RESTON, VA 20191
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04/27/2024 10:47 AM
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