Patent Assignment Details
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| Reel/Frame: | 054718/0265 | |
| Pages: | 3 |
| | Recorded: | 12/22/2020 | | |
| Attorney Dkt #: | 919.0098 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/12/2023
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Application #:
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17254905
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Filing Dt:
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12/22/2020
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Publication #:
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Pub Dt:
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08/26/2021
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Title:
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Semiconductor Processing Adhesive Tape and Method of Manufacturing Semiconductor Device
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Assignee
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| 23-23 HONCHO, ITABASHI-KU |
| TOKYO, JAPAN 173-0001 |
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Correspondence name and address
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CAHN & SAMUELS LLP
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1100 17TH STREET NW
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SUITE 401
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WASHINGTON, DC 20036
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05/03/2024 04:28 PM
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