Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 054923/0428 | |
| Pages: | 4 |
| | Recorded: | 01/14/2021 | | |
| Attorney Dkt #: | P053521-US-NP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/14/2023
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Application #:
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17149152
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Filing Dt:
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01/14/2021
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Publication #:
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Pub Dt:
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07/14/2022
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Title:
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PLANAR POWER MODULE WITH HIGH POWER DENSITY PACKAGING
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Assignee
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| P.O. BOX 300 |
| MAIL CODE 482-C23-B21 |
| DETROIT, MICHIGAN 48265-3000 |
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Correspondence name and address
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QUINN IP LAW
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21500 HAGGERTY ROAD, STE 300
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NORTHVILLE, MI 48167
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05/22/2024 05:20 AM
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