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Reel/Frame:055022/0912   Pages: 6
Recorded: 01/25/2021
Attorney Dkt #:TSMP20202030US02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/13/2022
Application #:
17157520
Filing Dt:
01/25/2021
Publication #:
Pub Dt:
01/27/2022
Title:
HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
Assignors
1
Exec Dt:
11/27/2020
2
Exec Dt:
11/27/2020
3
Exec Dt:
12/18/2020
4
Exec Dt:
01/20/2021
5
Exec Dt:
12/15/2020
6
Exec Dt:
11/25/2020
7
Exec Dt:
11/30/2020
Assignee
1
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
SLATER MATSIL, LLP/TSMC
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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