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Reel/Frame:055032/0882   Pages: 3
Recorded: 01/26/2021
Attorney Dkt #:TSMP20201569US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/16/2023
Application #:
17158409
Filing Dt:
01/26/2021
Publication #:
Pub Dt:
11/04/2021
Title:
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE VIA
Assignors
1
Exec Dt:
01/25/2021
2
Exec Dt:
01/25/2021
Assignee
1
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
SLATER MATSIL, LLP/TSMC
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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