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Reel/Frame:055037/0158   Pages: 5
Recorded: 01/26/2021
Attorney Dkt #:3434004US1AN
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/14/2022
Application #:
17263438
Filing Dt:
01/26/2021
Publication #:
Pub Dt:
12/16/2021
Title:
SEALING ASSEMBLY FOR ELECTRONIC COMPONENT AND UNDERWATER BOOSTER
Assignors
1
Exec Dt:
01/19/2021
2
Exec Dt:
01/19/2021
3
Exec Dt:
01/19/2021
4
Exec Dt:
01/19/2021
Assignee
1
BUILDING 7, JINBIN DEVELOPMENT INDUSTRIAL PARK
#45 MUNING ROAD
TIANJIN, CHINA 300457
Correspondence name and address
SAND, SEBOLT & WERNOW CO., LPA
AEGIS TOWER, SUITE 1100
4940 MUNSON STREET, NW
CANTON, OH 44718-3615

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