Patent Assignment Details
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| Reel/Frame: | 055056/0360 | |
| Pages: | 52 |
| | Recorded: | 01/21/2021 | | |
| Attorney Dkt #: | 20374-150881-US |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/20/2022
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Application #:
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17153993
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Filing Dt:
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01/21/2021
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Publication #:
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Pub Dt:
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05/13/2021
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Title:
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COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTOR DEVICE
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Assignee
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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ALAN E. SCHIAVELLI
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1250 23RD STREET NW, SUITE 410
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WASHINGTON, DC 20037-1164
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05/09/2024 02:55 AM
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