Patent Assignment Details
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| Reel/Frame: | 055078/0662 | |
| Pages: | 8 |
| | Recorded: | 01/29/2021 | | |
| Attorney Dkt #: | T0509.70052US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17261557
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Filing Dt:
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01/19/2021
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Publication #:
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Pub Dt:
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10/07/2021
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Title:
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SOLDER ALLOY, SOLDER POWDER, SOLDER PASTE, AND A SOLDER JOINT USING THESE
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Assignee
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 1208555 |
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Correspondence name and address
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MICHAEL J. POMIANEK
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WOLF, GREENFIELD & SACKS, P.C.
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600 ATLANTIC AVENUE
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BOSTON, MA 02210
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