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Reel/Frame:055102/0297   Pages: 4
Recorded: 02/01/2021
Attorney Dkt #:P284515.US.02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/08/2022
Application #:
17164454
Filing Dt:
02/01/2021
Publication #:
Pub Dt:
06/17/2021
Title:
Memory Core Chip Having TSVS
Assignors
1
Exec Dt:
10/01/2019
2
Exec Dt:
10/01/2019
Assignee
1
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83716-9632
Correspondence name and address
DORSEY & WHITNEY LLP
701 FIFTH AVENUE
SUITE 6100
SEATTLE, WA 98104

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