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Reel/Frame:055212/0854   Pages: 5
Recorded: 02/10/2021
Attorney Dkt #:1012-2854 / 2020P04257 US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/11/2023
Application #:
17158234
Filing Dt:
01/26/2021
Publication #:
Pub Dt:
07/28/2022
Title:
Semiconductor Package with Barrier to Contain Thermal Interface Material
Assignors
1
Exec Dt:
01/27/2021
2
Exec Dt:
01/27/2021
3
Exec Dt:
01/27/2021
4
Exec Dt:
01/27/2021
5
Exec Dt:
01/27/2021
6
Exec Dt:
02/09/2021
Assignee
1
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondence name and address
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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