Patent Assignment Details
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| Reel/Frame: | 055233/0724 | |
| Pages: | 8 |
| | Recorded: | 02/11/2021 | | |
| Attorney Dkt #: | P61748 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/19/2024
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Application #:
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17049456
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Filing Dt:
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10/21/2020
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Publication #:
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Pub Dt:
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09/09/2021
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Title:
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RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE
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Assignee
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN 1008324 |
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Correspondence name and address
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GREENBLUM & BERNSTEIN, P.L.C.
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1950 ROLAND CLARKE PLACE
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RESTON, VA 20191
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