Patent Assignment Details
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| Reel/Frame: | 055237/0345 | |
| Pages: | 9 |
| | Recorded: | 02/11/2021 | | |
| Attorney Dkt #: | 101716.000237 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/25/2022
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Application #:
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17268036
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Filing Dt:
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02/11/2021
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Publication #:
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Pub Dt:
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06/17/2021
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Title:
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COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRODUCING THE COPPER OXIDE SOLID, AND APPARATUS FOR SUPPLYING A PLATING SOLUTION INTO A PLATING TANK
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Assignee
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| 11-1, HANEDA ASAHI-CHO, OTA-KU |
| TOKYO, JAPAN 1448510 |
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Correspondence name and address
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BAKERHOSTETLER
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999 THIRD AVENUE
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SUITE 3900
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SEATTLE, WA 98104-4040
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05/02/2024 06:41 AM
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