Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 055317/0690 | |
| Pages: | 4 |
| | Recorded: | 02/18/2021 | | |
| Attorney Dkt #: | 2007P00869US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/13/2022
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Application #:
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15859853
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Filing Dt:
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01/02/2018
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Publication #:
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Pub Dt:
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05/03/2018
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Title:
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Generating high speed ultrasonic thick slice imaging by combining data in elevation direction via volumetric rendering process
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Assignee
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| HIGH TECH CAMPUS 5 |
| EINDHOVEN, NETHERLANDS 5656 AG |
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Correspondence name and address
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PHILIPS INTELLECTUAL PROPERTY & STANDARD
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465 COLUMBUS AVENUE
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SUITE 340
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VALHALLA, NY 10595
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05/22/2024 09:25 AM
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