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Reel/Frame:055329/0013   Pages: 2
Recorded: 02/19/2021
Attorney Dkt #:2304.1004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/18/2022
Application #:
17179037
Filing Dt:
02/18/2021
Publication #:
Pub Dt:
09/09/2021
Title:
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING A MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD
Assignor
1
Exec Dt:
02/15/2021
Assignee
1
7-19 KYOBASHI 2-CHOME, CHUO-KU,
TOKYO, JAPAN 104-0031
Correspondence name and address
STEIN IP LLC
1990 M STREET, NW SUITE 610
SUITE 610
WASHINGTON, DC 20036

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