Patent Assignment Details
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| Reel/Frame: | 055393/0949 | |
| Pages: | 6 |
| | Recorded: | 02/24/2021 | | |
| Attorney Dkt #: | 533802US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/06/2024
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Application #:
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17271091
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Filing Dt:
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02/24/2021
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Publication #:
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Pub Dt:
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12/02/2021
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Title:
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PRODUCTION METHOD FOR CHIP MADE OF THERMOELECTRIC CONVERSION MATERIAL AND METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE USING CHIP OBTAINED BY SAID PRODUCTION METHOD
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Assignee
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| 23-23, HONCHO |
| ITABASHI-KU, TOKYO, JAPAN 173-0001 |
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Correspondence name and address
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OBLON, ET AL.
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1940 DUKE STREET
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ALEXANDRIA, VA 22314
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05/07/2024 09:19 AM
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