Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 055429/0859 | |
| Pages: | 3 |
| | Recorded: | 02/26/2021 | | |
| Attorney Dkt #: | 0096-0091D2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2023
|
Application #:
|
17249325
|
Filing Dt:
|
02/26/2021
|
|
Publication #:
|
|
Pub Dt:
|
06/24/2021
| | | | |
|
Title:
|
SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP, AND LEADFRAME AND A METHOD FOR FABRICATING THE SAME
|
|
|
Assignee
|
|
|
|
|
| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
|
|
Correspondence name and address
|
| |
HARRITY & HARRITY, LLP
|
| |
11350 RANDOM HILLS ROAD
|
| |
SUITE 600
|
| |
FAIRFAX, VA 22030
|
Search Results as of:
05/13/2024 09:43 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
