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Reel/Frame:055464/0218   Pages: 4
Recorded: 03/02/2021
Attorney Dkt #:SGW-1500US01-CE
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/17/2023
Application #:
17188739
Filing Dt:
03/01/2021
Publication #:
Pub Dt:
07/01/2021
Title:
PACKAGING STRUCTURE AND PACKAGING METHOD OF DIGITAL CIRCUIT
Assignors
1
Exec Dt:
02/23/2021
2
Exec Dt:
02/23/2021
3
Exec Dt:
02/23/2021
4
Exec Dt:
02/23/2021
5
Exec Dt:
02/23/2021
6
Exec Dt:
02/23/2021
7
Exec Dt:
02/23/2021
Assignee
1
NO. 113 COOPERATION ROAD, XINHUA DISTRICT, HEBEI
SHIJIAZHUANG, CHINA 050051
Correspondence name and address
SLATER MATSIL LLP
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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