Patent Assignment Details
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Reel/Frame: | 055514/0484 | |
| Pages: | 36 |
| | Recorded: | 02/01/2021 | | |
Attorney Dkt #: | 53EH-299955-US |
Conveyance: | EMPLOYMENT AGREEMENT-CONTRACT |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/2021
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Application #:
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16950020
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Filing Dt:
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11/17/2020
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Publication #:
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Pub Dt:
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03/11/2021
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Title:
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THROUGH-SILICON VIA (TSV) TEST CIRCUIT, TSV TEST METHOD AND INTEGRATED CIRCUITS (IC) CHIP
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Assignee
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ROOM 630, HAIHENG BUILDING, NO. 6, CUIWEI ROAD |
ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE |
HEFEI, ANHUI, CHINA 230000 |
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Correspondence name and address
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SHEPPARD MULLIN RICHTER & HAMPTON LLP
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379 LYTTON AVENUE
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ATTN: JING ZHENG
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PALO ALTO, CA 94301
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