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Reel/Frame:055520/0508   Pages: 7
Recorded: 03/08/2021
Attorney Dkt #:3590-1038CIP
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/31/2023
Application #:
17194636
Filing Dt:
03/08/2021
Publication #:
Pub Dt:
09/08/2022
Title:
ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-WAFER BONDING
Assignors
1
Exec Dt:
02/27/2021
2
Exec Dt:
02/26/2021
3
Exec Dt:
03/02/2021
4
Exec Dt:
03/02/2021
5
Exec Dt:
03/02/2021
6
Exec Dt:
03/02/2021
7
Exec Dt:
03/02/2021
8
Exec Dt:
03/02/2021
9
Exec Dt:
03/08/2021
10
Exec Dt:
02/26/2021
11
Exec Dt:
03/02/2021
Assignee
1
5601 GREAT OAKS PARKWAY
SAN JOSE, CALIFORNIA 95119
Correspondence name and address
THE MARBURY LAW GROUP, PLLC
11800 SUNRISE VALLEY DRIVE
15TH FLOOR
RESTON, VA 20191

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