Patent Assignment Details
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| Reel/Frame: | 055569/0643 | |
| Pages: | 2 |
| | Recorded: | 03/12/2021 | | |
| Attorney Dkt #: | FP18-0689-00US-HTC |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/24/2023
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Application #:
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17267023
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Filing Dt:
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02/09/2021
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Publication #:
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Pub Dt:
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10/07/2021
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Title:
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ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
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Assignee
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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SOEI PATENT & LAW FIRM
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3033 WILSON BLVD, SUITE 700
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ARLINGTON, VA 22201
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04/29/2024 01:54 PM
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