Patent Assignment Details
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| Reel/Frame: | 055623/0589 | |
| Pages: | 9 |
| | Recorded: | 03/17/2021 | | |
| Attorney Dkt #: | USCP11002C/NB7827-SYO |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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17203673
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Filing Dt:
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03/16/2021
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Publication #:
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Pub Dt:
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07/01/2021
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Title:
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Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof
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Assignee
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| 66-68 SHUNYU ROAD, |
| YUYAO CITY, NINGBO, ZHEJIANG PROVINCE, CHINA 315400 |
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Correspondence name and address
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RAYMOND Y CHAN
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108 N. YNEZ AVE., SUITE 128
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MONTEREY PARK, CA 91754
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