Patent Assignment Details
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| Reel/Frame: | 055673/0244 | |
| Pages: | 4 |
| | Recorded: | 03/22/2021 | | |
| Attorney Dkt #: | 00158.0753.00US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/06/2024
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Application #:
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17208511
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Filing Dt:
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03/22/2021
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Publication #:
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Pub Dt:
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10/14/2021
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Title:
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SEMICONDUCTOR FABRICATION METHOD AND STRUCTURE USING MULTIPLE SACRIFICIAL LAYERS TO FORM SIDEWALL SPACERS
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Assignees
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| 18 ZHANGJIANG ROAD, PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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| NO.18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT |
| BEIJING, CHINA 100716 |
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Correspondence name and address
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ANOVA LAW GROUP C/O SMIC
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21495 RIDGETOP CIRCLE
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SUITE 300
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STERLING, VA 20166
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05/13/2024 04:34 AM
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