Patent Assignment Details
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| Reel/Frame: | 055675/0715 | |
| Pages: | 6 |
| | Recorded: | 03/22/2021 | | |
| Attorney Dkt #: | 194574 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/08/2022
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Application #:
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17278611
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Filing Dt:
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03/22/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Title:
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BONDED SUBSTRATE, METAL CIRCUIT BOARD, AND CIRCUIT BOARD
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Assignee
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| 1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-8338 |
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Correspondence name and address
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MEGAN BOWERS
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OLIFF PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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