Patent Assignment Details
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| Reel/Frame: | 055705/0001 | |
| Pages: | 11 |
| | Recorded: | 03/24/2021 | | |
| Attorney Dkt #: | 38780.04022 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17263149
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Filing Dt:
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01/25/2021
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Publication #:
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Pub Dt:
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09/30/2021
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Title:
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SiC WAFER AND MANUFACTURING METHOD FOR SiC WAFER
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Assignees
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| 1-1, SHOWA-CHO, KARIYA-CITY |
| AICHI, JAPAN 4488661 |
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| 7-12, TAKESHIMA 5-CHOME |
| NISHIYODOGAWA-KU, OSAKA-SHI |
| OSAKA, JAPAN 5550011 |
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| 9-8, MEIEKI 4-CHOME |
| NAKAMURA-KU |
| NAGOYA, JAPAN 4508575 |
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Correspondence name and address
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YIZHOU LIU
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CALFEE, HALTER & GRISWOLD LLP
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1405 EAST SIXTH STREET
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CLEVELAND, OH 44114-1607
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04/29/2024 07:44 AM
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