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Reel/Frame:055745/0199   Pages: 4
Recorded: 03/29/2021
Attorney Dkt #:107960-US-1097-PCT(CA)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/24/2023
Application #:
17211871
Filing Dt:
03/25/2021
Publication #:
Pub Dt:
07/08/2021
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SUBSTRATE
Assignor
1
Exec Dt:
01/27/2021
Assignee
1
1-310, 42-1, BESSHO 1-CHOME, HACHIOJI-SHI,
TOKYO, JAPAN 1920363
Correspondence name and address
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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