Patent Assignment Details
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| Reel/Frame: | 055770/0956 | |
| Pages: | 10 |
| | Recorded: | 03/30/2021 | | |
| Attorney Dkt #: | VIIV041-19-DIOD-002-US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/19/2022
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Application #:
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17059084
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Filing Dt:
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11/25/2020
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Publication #:
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Pub Dt:
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12/02/2021
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Title:
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PACKAGING PROCESS FOR PLATING WITH SELECTIVE MOLDING
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Assignee
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| 63 LANCASTER AVENUE |
| MALVERN, PENNSYLVANIA 19355 |
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Correspondence name and address
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RYAN W. O'DONNELL
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VOLPE KOENIG
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30 SOUTH 17TH STREET, 18TH FLOOR
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PHILADELPHIA, PA 19103
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