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Reel/Frame:055771/0251   Pages: 3
Recorded: 03/30/2021
Attorney Dkt #:1012-2964/2019P51112 US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17217473
Filing Dt:
03/30/2021
Publication #:
Pub Dt:
07/15/2021
Title:
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR DIE EMBEDDED IN A MOLDING COMPOUND
Assignors
1
Exec Dt:
08/22/2019
2
Exec Dt:
08/22/2019
Assignee
1
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondence name and address
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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