Patent Assignment Details
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| Reel/Frame: | 055781/0290 | |
| Pages: | 4 |
| | Recorded: | 03/31/2021 | | |
| Attorney Dkt #: | 890102.544 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/14/2023
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Application #:
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17103772
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Filing Dt:
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11/24/2020
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Publication #:
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Pub Dt:
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07/29/2021
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Title:
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METHOD AND SYSTEM FOR SEMICONDUCTOR WAFER DEFECT REVIEW
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SEED IP LAW GROUP LLP - DAVID CONLEE
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701 FIFTH AVENUE
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SUITE 5400
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SEATTLE, WA 98104
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