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Reel/Frame:055791/0568   Pages: 10
Recorded: 04/01/2021
Attorney Dkt #:103122-00004US / AMG
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/23/2024
Application #:
17282001
Filing Dt:
04/01/2021
Publication #:
Pub Dt:
05/26/2022
Title:
ELECTRONIC DEVICE, SEMICONDUCTOR DEVICE, PACKAGING STRUCTURE, BRACKET AND METHOD OF MANUFACTURING THE BRACKET
Assignors
1
Exec Dt:
03/29/2021
2
Exec Dt:
03/29/2021
3
Exec Dt:
03/29/2021
4
Exec Dt:
03/29/2021
5
Exec Dt:
03/29/2021
6
Exec Dt:
03/29/2021
7
Exec Dt:
03/29/2021
Assignee
1
BUILDING A1, INNOVATION CITY
SONGSHAN LAKE UNIVERSITY
DONGGUAN CITY, GUANGDONG, CHINA 523000
Correspondence name and address
THOMPSON HINE LLP
10050 INNOVATION DRIVE
SUITE 400
DAYTON, OH 45342-4934

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