Patent Assignment Details
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| Reel/Frame: | 055956/0781 | |
| Pages: | 3 |
| | Recorded: | 04/16/2021 | | |
| Attorney Dkt #: | SP20-051 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17232746
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Filing Dt:
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04/16/2021
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Publication #:
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Pub Dt:
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08/26/2021
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Title:
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TEMPORARY BONDING OF SUBSTRATES WITH LARGE ROUGHNESS USING MULTILAYERS OF POLYELECTROLYTES
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Assignee
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| SP-TI-3-1 |
| CORNING, NEW YORK 14831 |
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Correspondence name and address
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CORNING INCORPORATED
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SP-TI-3-1
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CORNING, NY 14831
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05/10/2024 01:30 PM
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