Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 056085/0680 | |
| Pages: | 4 |
| | Recorded: | 04/29/2021 | | |
| Attorney Dkt #: | SP18-081 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/19/2023
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Application #:
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17043561
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Filing Dt:
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09/29/2020
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Publication #:
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Pub Dt:
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01/28/2021
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Title:
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HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND METHODS FOR MAKING THE SAME
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Assignee
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| ONE RIVERFRONT PLAZA |
| CORNING, NEW YORK 14831 |
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Correspondence name and address
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CORNING INCORPORATED
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SP-TI-3-1
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CORNING, NY 14831
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05/13/2024 02:20 AM
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